LED Encapsulated PCB vs. DPC Ceramic PCB: Unraveling the Differences

In the vibrant tapestry of cities, LED lights play a pivotal role in decoration. LED, omnipresent in various aspects of our lives, illuminates our surroundings.

As a carrier for heat and air convection, the Power LED Encapsulated Printed Circuit Board (PCB) plays a crucial role in determining the heat dissipation of light-emitting diodes. Gradually becoming a driving force in electronic packaging materials due to its outstanding performance and decreasing costs, Direct Bonded Copper (DBC) Ceramic PCB displays strong competitiveness, emerging as a future trend in power LED encapsulation. With advancing scientific technologies and the emergence of new manufacturing techniques, high thermal conductivity ceramic materials, as a novel electronic packaging PCB material, hold vast application prospects.

LED encapsulation technology has largely evolved from discrete device packaging technology but possesses distinct characteristics. Unlike the encapsulation of discrete devices where the core is sealed inside the package primarily for protection, LED encapsulation serves the dual purpose of facilitating the normal operation of the core while achieving the output of visible light. It requires intricate design and technical specifications that encompass both electrical and optical parameters, differentiating it from conventional discrete device encapsulation.

As the input power for LED chips continues to rise, the significant heat generated necessitates higher requirements for LED encapsulation materials. In the heat dissipation channel of LED, the encapsulated printed circuit board becomes a critical link connecting internal and external heat dissipation channels, featuring functions of heat dissipation, circuit connection, and physical support for the chip. For high-power LED products, the encapsulated printed circuit board requires high insulation, high thermal conductivity, and a thermal expansion coefficient matching the chip.

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