Ceramic Substrates
Our ceramic substrates are specifically designed to meet the demanding requirements of various industries. These industries include LED, semiconductor, automotive electronics, microwave communication, and IGBT power modules.
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Ceramic circuit board
DPC (Direct Plated Copper)
DPC
Our innovative Direct Plated Copper (DPC) process combines ceramic's heat dissipation and copper's conductivity, enabling direct plating onto ceramic substrates. The technique employs sputtering and photolithography to create circuit patterns on ceramic substrates.
Sputtering ensures strong metal-ceramic bonding, preventing lifting of traces and pads. Additionally, the process enables highly precise positioning and increased line width/spacing density compared to traditional thick film printing methods.
Material
Aluminum nitride (AIN) / Aluminum oxide
Usage
This technique is mainly used in the fields of:
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High brightness, high-power LED
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RF microwave communication
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Laser system
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Semiconductor equipment
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etc
AMB (Active Metal Brazing)
AMB
By harnessing the exceptional heat dissipation of ceramics and the excellent conductivity of copper, we utilize a specific brazing material to join ultra-thick copper foil with silicon nitride substrates at high temperatures. The subsequent photolithography process enables the creation of circuit patterns on the silicon nitride substrate.
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This technology empowers the substrate:
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High thermal conductivity
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Superior heat dissipation
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Ensuring exceptional reliability for demanding applications.
Material
Silicon nitride
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Usage
This technique is mainly used in the field of high-power modules for energy conversion, electric vehicles, trams, and charging systems, etc.
